Marginal Defects
Testonica celebrates 15 years of uninterrupted innovation
Testonica was founded back in Oct 2005 when several fresh PhD graduates decided to convert their R&D experience into industrial technologies and products, which turned out to be very hard as the dreams were ambitious while commercial and industrial skills were missing. Still, the hard work and everyday learning by trial and error yielded their sweet fruits and made us finally see the great bright future coming!
Testonica delivers technology for testing BGAs Power/Ground solder joints without X-Ray
Testing solder joints of BGA packages upon PCB assemblies is a challenging task unless X-Ray equipment is available. In numerous cases X-Ray (AXI) is too costly while functional test (FCT) and IEEE 1149.1 Boundary Scan (JTAG) cannot catch open defects in power or ground nets. During Nordic Test Forum (NTF'2019) conference in Tallinn this week, Testonica has presented a ground breaking technology capable to detect defects in Power Delivery Network (PDN) of FPGA-based products using no AXI.
Testonica delivers technology for Marginal Defect detection on DDR3/4 bus
Marginal Defects, such as excessive voids in solder joints, dewetting, head-in-pillow and alike do not necessarily cause malfunctions, but may result in system performance issues, increased error rates, intermittent faults and other sporadic stability issues observed in certain operation modes, at certain workloads or manifesting in a seemingly stochastic manner. As a result, Marginal Defects may lead to No Fault/Trouble Found (NFF/NTF) scenarios.