Testing solder joints of BGA packages upon PCB assemblies is a challenging task unless X-Ray equipment is available. In numerous cases X-Ray (AXI) is too costly while functional test (FCT) and IEEE 1149.1 Boundary Scan (JTAG) cannot catch open defects in power or ground nets. During Nordic Test Forum (NTF'2019) conference in Tallinn this week, Testonica has presented a ground breaking technology capable to detect defects in Power Delivery Network (PDN) of FPGA-based products using no AXI.