26 February 2019, at embedded world exhibition in Nürnberg, ChipVORX-SI (Synthetic Instruments), a technology jointly developed by Testonica and GÖPEL electronic has received a prestigious embedded award in tools category. ChipVORX-SI allows configuring a test design for FPGAs easily and without developer knowledge - this convinced the jury of the embedded award 2019.
Testonica Lab has just signed a contract with EP-TeQ for the sales and distribution of its Quick Instruments solutions in the Nordic, Baltic and Benelux area. "Testonica has been a valued partner of ours already for several years, so it is also a pleasure for us that their Quick Instruments are now ready for distribution", says Director at EP-TeQ, Lars Kongsted-Jensen. "It is opening new doors to us that their embedded instrument IPs now can be used in a more open and flexible way".
Marginal Defects, such as excessive voids in solder joints, dewetting, head-in-pillow and alike do not necessarily cause malfunctions, but may result in system performance issues, increased error rates, intermittent faults and other sporadic stability issues observed in certain operation modes, at certain workloads or manifesting in a seemingly stochastic manner. As a result, Marginal Defects may lead to No Fault/Trouble Found (NFF/NTF) scenarios.
In its Aug-Sept issue, IEEE Instrumentation & Measurement Magazine published our technical paper that was originally presented last year at AUTOTESTCON conference in Anaheim, CA. It is one of six conference papers selected for the journal on a quality basis out of the total of 80 AUTOTESTCON'2016 contributions.